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1 tape bumping
виготовлення стовпчикових виводів на стрічковому носіїEnglish-Ukrainian dictionary of microelectronics > tape bumping
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2 tape bumping technolog/y
технологія формування стовпчикових виводів на стрічковому носіїEnglish-Ukrainian dictionary of microelectronics > tape bumping technolog/y
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3 bumping
виготовлення стовпчикових виводів - wafer bumping -
4 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
См. также в других словарях:
tape bumping — juostinio tiekiklio gūburinių išvadų formavimas statusas T sritis radioelektronika atitikmenys: angl. tape bump formation; tape bumping vok. Herstellung von Bondhügeln am Filmbandträger, f rus. формирование столбиковых выводов на ленточном… … Radioelektronikos terminų žodynas
tape bump formation — juostinio tiekiklio gūburinių išvadų formavimas statusas T sritis radioelektronika atitikmenys: angl. tape bump formation; tape bumping vok. Herstellung von Bondhügeln am Filmbandträger, f rus. формирование столбиковых выводов на ленточном… … Radioelektronikos terminų žodynas
Herstellung von Bondhügeln am Filmbandträger — juostinio tiekiklio gūburinių išvadų formavimas statusas T sritis radioelektronika atitikmenys: angl. tape bump formation; tape bumping vok. Herstellung von Bondhügeln am Filmbandträger, f rus. формирование столбиковых выводов на ленточном… … Radioelektronikos terminų žodynas
fabrication des poutres sur la bande porteuse — juostinio tiekiklio gūburinių išvadų formavimas statusas T sritis radioelektronika atitikmenys: angl. tape bump formation; tape bumping vok. Herstellung von Bondhügeln am Filmbandträger, f rus. формирование столбиковых выводов на ленточном… … Radioelektronikos terminų žodynas
juostinio tiekiklio gūburinių išvadų formavimas — statusas T sritis radioelektronika atitikmenys: angl. tape bump formation; tape bumping vok. Herstellung von Bondhügeln am Filmbandträger, f rus. формирование столбиковых выводов на ленточном носителе, n pranc. fabrication des poutres sur la… … Radioelektronikos terminų žodynas
формирование столбиковых выводов на ленточном носителе — juostinio tiekiklio gūburinių išvadų formavimas statusas T sritis radioelektronika atitikmenys: angl. tape bump formation; tape bumping vok. Herstellung von Bondhügeln am Filmbandträger, f rus. формирование столбиковых выводов на ленточном… … Radioelektronikos terminų žodynas
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